博文

目前显示的是 一月, 2021的博文

What are PCB Plating Through Hole, Blind Via Hole and Buried Via Hole?

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  PCB vias are divided into three types: Plating Through Hole, Blind Via Hole and Buried Via Hole. The copper foil traces between conductive patterns in different layers of the circuit board are connected through vias.The printed circuit board is formed by the accumulation of many copper foil layers. The copper foil layers cannot communicate with each other because each layer of copper foil is covered with an insulating layer,so they need to rely on vias for signal connection.   Plating Through Hole Plating Through holes are the most common and simplest type of guide holes. As long as the light is directed at the PCB, the hole that sees the bright light is the through hole. The production process is also very  simple. We can j ust use a drill ing tool  to drill PCBs  from top to bottom completely . The cost is relatively low, but it will take up more space. Although it is cheap, it is not very practical for every printed circuit board.   Blind   Via...

What is PCB sinking gold, gold plating. What is their difference?

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  What is Immersion Gold, Gold Plated Immersion gold uses a chemical deposition method, which generates a layer of plating through a chemical oxidation-reduction reaction, which is usually thick. The gold layer deposition method is a kind of chemical nickel gold, which can reach a thicker gold layer. Gold plating uses the principle of electrolysis, also known as electroplating. Most other metal surface treatments also use electroplating. It is to deposit a thin layer of gold on the surface of another metal by electroplating. Moreover, due to the strong adhesion of gold plating, gold particles are mainly attached to the circuit board, so it is also called hard gold.   Immersion gold application range It is mainly used for high-demand sheet products, and has better requirements for flatness. Generally, heavy gold is used. After assembly, the heavy gold generally does not look like a black pad. The flatness and service life of the immersion gold plate are better than that of the ...

Explanation of SMT, PCB,PCBA and DIP

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  SMT components The name of SMT is surface mount technology, which is one of the basic components of electronic components. There are two kinds of lead-free and short lead. The circuit assembly connection technology that is soldered by reflow soldering and dip soldering is the most common technology and process in the electronic assembly industry. POE   PCB manufacturers   have their own SMT mold factory with professional capabilities, with various SMT molds, such as: etching SMT Stone Latier with frame, SMT Stone Latier without frame, laser cutting SMT with frame Mold, laser cutting SMT mold without frame, etc. We not only have surface mount technology for rigid circuit boards, but also surface mount technology for flexible circuit boards. It has space saving, folding, mobile use and high-frequency performance, but the assembly process is complicated and difficult. Short-pitch connections are not recommended. PCB components PCB is the most important of electronic compon...

PCB layout skills

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  1. Layout the components in the board in advance Layout of components in advance tests the PCB designer’s understanding and design ability of schematic diagrams. The shape and size of the board must be determined before layout, which is related to the cost of production and actual use in reality. After drawing the board shape, the main control chip is generally placed in the center of the board. Of course, this is not a mandatory requirement and needs to be determined according to the actual use. The external thimble should be placed on the edge of the board. The power supply is generally placed in an open area of the board to facilitate heat dissipation. The real-time memory chip is placed around the main chip for storage. 2. Choose a good grounding point Many engineers and technicians have discussed the small grounding point, which shows its importance. Under normal circumstances, a common ground is required, such as: multiple ground wires of the forward amplifier should be com...

Process and advantages of PCB laser drilling

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  Process and advantages of PCB laser drilling Process and advantages of PCB laser drilling The 21st century is a period of rapid development of electronic technology. More and more integrated circuits are widely used, making printed circuit boards more and more multi-layered and multifunctional. At the same time, fast turnkey is one of the competitive advantages of  PCB manufacturers , such as Rapid  PCB assembly ,  PCB prototyping , etc. Traditional mechanical drilling methods can no longer meet the demand, and new laser drilling technologies have developed rapidly in this environment. Principle of laser drilling Laser is a powerful beam of light that is excited when the "ray" is stimulated by external sources and increases in energy. Infrared and visible light have thermal energy, and ultraviolet light has optical energy. When this type of light hits the surface of the workpiece, three  phenomena occur ,  namely reflection ,  absorption  and...

Some PCB technology and numerical introduction

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  1. Countersink hole A conical hole which is cut to allow the flat head screw to be used is called a countersink hole. It can also be called as a conical hole that is cut into a PCB laminate, or a hole created by using a drill. The main purpose is to let the head of a countersunk screw, once it is inserted and screwed down in the hole, to sit flush with the surface of the laminate. The cone shaped hole, which is cut into the PCB laminate, is a countersink. It is generally used to permit the tapered head of a screw to sit flush with the top or bottom of the laminate. It is mainly used, so that the flat head screw can sit flush with the surface to have a clean look and installation. To ensure correct design for manufacturing, most manufacturers require the details of the hole diameter. They also need to know if the hole is plated or not. Knowing if the hole is plate or not is critical because in some situations an unplated hole may be grounded to the framework, which could cause a p...