Fanklan Steven

  Factors of increasing the value of automotive PCB In recent years, the trend of automobile electrification and electronics has become more and more obvious. As the backbone of electronic products, the importance of  PCB  manufacturing in the automotive supply chain is also increasing day by day. Compared with traditional fuel vehicles, the addition of charging, energy storage, power distribution and voltage conversion equipment for new energy vehicles will bring a large number of new application scenarios to PCBs. At the same time, although autonomous driving above L4 cannot be mass-produced in a short time, the gradual penetration of a variety of intelligent driving components will bring rapid development opportunities for the application of high-end high-frequency PCBs in automobiles. According to calculations by relevant departments, only in the powertrain and transmission fields, the value of PCBs on electric vehicles is as high as about RMB 800 per bicycle, which i...

  The difference of pcb materials Take the ordinary double-sided board as an example. The sheet materials are generally fr-4, cem-3, etc. The thickness of the sheet varies from 0.2mm to 3.0mm, and the thickness of copper varies from 0.5oz to 3oz. All of these are based on the sheet material. This has caused a huge price difference; in terms of solder mask ink, there is also a certain price difference between ordinary thermosetting oil and photosensitive green oil, so the difference in materials has caused the price diversity. The difference in pcb production process Different production processes will cause different costs. Such as gold-plated and tin-sprayed boards, the production of gongs (milling) boards and beer (punching) boards, as well as a series of special processing such as gold fingers, buried blind holes, etc., the use of silk screen lines and dry film lines will make a difference The cost, leading to price diversity. PCB itself is different in difficulty Even if the ma...

  What is HDI PCB ？ HDI  is a rapidly developing technology in the PCB industry. Compared with the traditional PCB, HDI board has higher wiring density, finer pitch and line width, smaller vias and hole pads, and higher connection pad density. Generally, laser drilling technology is used to drill the smallest micro-holes, and HDI boards usually contain blind holes and/or buried holes (different from the through holes from the surface to the surface) By using HDI technology, designers can choose to place more components on both sides of the board. Use reduced part size and pitch to achieve more input/output in a smaller geometric space. This means faster signal transmission and significantly reduced signal loss and signal delay. Compared with the traditional circuit board design, due to the tiny pads and fine pitch on the HDI board, the mounting of these components on the HDI board requires higher precision. For example, HDI technology makes it possible to reduce an 8-layer thr...

  FR-4 FR in   FR4  stands for flame retardant, whereas the number 4 differentiates the material from other materials in this class. FR4 is a fiberglass-reinforced epoxy laminated sheet, which looks like a thin, and woven cloth sheet. The term FR4 also stands for the grade used to make these laminated sheets. The fiberglass construction provides structural stability to the material. The fiberglass layer is covered with an epoxy resin that is flame-resistant. This lends durability and strong mechanical properties to the material. All these properties make FR4 printed circuit boards popular among electronic contract manufacturers. Applications： 1. DC Board Applications: The vast majority of DC boards are completed with FR4 due to its low cost, excellent performance and accessibility. 2. Low-Frequency Applications: FR4 boards are commonly used in low-frequency applications due to their low cost and comparability to other materials. While FR4 is not ideal for high-f...

  What is back drilling Back-drilling is a process of creating vias by removing short wires in a multilayer printed circuit board, facilitating the flow of signals from one layer of the board to another, ensuring that signals with the highest fidelity are transmitted at a faster speed. For example, for 18-layer boards, we want them to be connected. In theory, we need to drill through holes and plate copper from layer 1 to layer 18. In fact, it is not necessary to go from the first to the 18th layer, as long as the through holes are in the first to the 16th layer. The 17th and 18th layers are not connected by wires, which affects the signal path and may cause signal integrity problems in the communication signal. We drilled the two layers from the back, which is called "STUB", which reduces the difficulty and cost of the production process. The process first requires positioning holes for positioning and punching. Electroplate the first drilled PCB, seal the positioning hole w...