The challenge of 5G communication to PCB technology
5G communication is a huge and complex integrated technology, and its challenges to the PCB process are mainly focused on: large size, multilayer, high frequency, high speed, low loss, high density, rigid-flex combination, high and low frequency mixed pressure, etc. So many process technologies put forward new or higher requirements for PCB materials, design, processing, and quality control. PCB companies need to understand the changing needs and propose comprehensive solutions. Material requirements: A very clear direction for 5G PCB is high-frequency and high-speed materials. In terms of high-frequency materials, it can be clearly seen that the leading PCB material manufacturers in the traditional high-speed field in China have begun to deploy high-frequency plates and introduced a series of new materials. This will break the current dominance of foreign brands in the high-frequency sheet industry. After healthy competition, the per...